2-Ethylimidazole

CAS NO. 1072-62-4

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epoxy curing agent pharmaceutical intermediate agrochemical intermediate chemical catalyst

Product Description

Applications

Parameter	Standard Specification
Product Name	2-Ethylimidazole
CAS Number	1072-62-4
Molecular Formula	C₅H₈N₂
Molecular Weight	96.13 g/mol
Appearance (Color)	White to light yellow
Appearance (Form)	Flakes/Crystalline powder
Melting Point	83°C to 87°C
Boiling Point	268°C
Purity (GC)	≥98.5%
Water Content (KF)	≤0.5%
Imidazole Content (GC)	≤1.0%
Infrared Spectrum	Conforms to standard
Storage Conditions	Tightly closed, dry conditions

✓ All testing results conform to enterprise standards. Product certified for R&D and industrial applications.

Commercial Applications of 2-Ethylimidazole (CAS 1072-62-4)

A versatile high-performance catalyst and curing accelerator for advanced polymer systems. Proven effectiveness at low concentrations (0.1-2%) with excellent compatibility across multiple resin platforms. It is widely used in manufacturing for faster processing, improved mechanical properties, and enhanced productivity.

• Epoxy Resin Systems - Primary Application

Highly effective accelerator that significantly reduces cure times while maintaining excellent shelf stability. Enables faster production cycles and improved throughput in manufacturing operations.

Productos finales: Industrial coatings, automotive primers, structural adhesives, PCB laminates, aerospace composites, electronic encapsulants

• Polyurethane Catalyst Systems

Environmentally preferred alternative to traditional tin-based catalysts. Provides excellent reactivity control for isocyanate-polyol reactions with reduced toxicity concerns.

Productos finales: Flexible foams, rigid insulation, automotive elastomers, protective coatings, industrial sealants

• Chemical Intermediate & Specialty Applications

Versatile building block for pharmaceutical APIs, agrochemical synthesis, and corrosion inhibitor formulations. High purity grades (≥99%) available for critical applications.

Productos finales: Antifungal agents, crop protection chemicals, pipeline corrosion inhibitors

• Electronics & Advanced Materials

Critical component for electronic assembly processes requiring precise cure profiles and thermal stability. Enables miniaturization and enhanced performance in electronic devices.

Productos finales: Circuit board assembly, semiconductor packaging, flexible displays, conductive films, touch screen components